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MMSTA56 数据表(PDF) 1 Page - Diodes Incorporated |
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MMSTA56 数据表(HTML) 1 Page - Diodes Incorporated |
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1 / 4 page ![]() Lead-free Green DS30167 Rev. 9 - 2 1 of 4 MMSTA55/MMSTA56 www.diodes.com © Diodes Incorporated MMSTA55/MMSTA56 PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR • Epitaxial Planar Die Construction • Complementary NPN Type Available (MMSTA05/MMSTA06) • Ideal for Low Power Amplification and Switching • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 2) • "Green" Device (Note 3 and 4) Features Maximum Ratings @ TA = 25 °C unless otherwise specified A M J L E D B C H K G B E C Mechanical Data • Case: SOT-323 • Case Material: Molded Plastic, "Green" Molding Compound, Note 4. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020C • Terminal Connections: See Diagram • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). • MMSTA55 Marking K2H, K2G (See Page 2) • MMSTA56 Marking K2G (See Page 2) • Ordering & Date Code Information: See Page 2 • Weight: 0.006 grams (approximate) Characteristic Symbol MMSTA55 MMSTA56 Unit Collector-Base Voltage VCBO -60 -80 V Collector-Emitter Voltage VCEO -60 -80 V Emitter-Base Voltage VEBO -4.0 V Collector Current - Continuous (Note 1) IC -500 mA Power Dissipation (Note 1) Pd 200 mW Thermal Resistance, Junction to Ambient (Note 1) RθJA 625 °C/W Operating and Storage and Temperature Range Tj, TSTG -55 to +150 °C SOT-323 Dim Min Max A 0.25 0.40 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal E 0.30 0.40 G 1.20 1.40 H 1.80 2.20 J 0.0 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.18 α 0 ° 8 ° All Dimensions in mm Note: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. No purposefully added lead. 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. E B C SPICE MODELS: MMSTA55 MMSTA56 |
类似零件编号 - MMSTA56 |
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类似说明 - MMSTA56 |
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