Lead-free Green

DS30303 Rev. 7 - 2

1 of 4

IMT4

www.diodes.com

·

Epitaxial Planar Die Construction

·

Complementary NPN Type Available (IMX8)

·

Small Surface Mount Package

·

Lead Free/RoHS Compliant (Note 3)

·

"Green" Device, Note 4 and 5

Maximum Ratings

A

M

J

L

D

F

B C

H

K

B

2

B

1

E

1

C

2

E

2

C

1

Mechanical Data

·

Case: SOT-26

·

Case Material: Molded Plastic, "Green" Molding

Compound, Note 5. UL Flammability Classification

Rating 94V-0

·

Moisture Sensitivity: Level 1 per J-STD-020C

·

Terminal Connections: See Diagram

·

Terminals: Solderable per MIL-STD-202, Method 208

·

Lead Free Plating (Matte Tin Finish annealed over

Copper leadframe).

·

Marking: KX7, See Page 2

·

Ordering & Date Code Information: See Page 2

·

Weight: 0.016 grams (approximate)

IMT4

DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

-120

V

Collector-Emitter Voltage

-120

V

Emitter-Base Voltage

-5.0

V

Collector Current - Continuous

-50

mA

Power Dissipation (Note 1)

225

mW

Thermal Resistance, Junction to Ambient (Note 1)

555

°

C/W

Operating and Storage Temperature Range

-55 to +150

°

C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 2)

Collector-Base Breakdown Voltage

-120

¾

¾

V

Collector-Emitter Breakdown Voltage

-120

¾

¾

V

Emitter-Base Breakdown Voltage

-5.0

¾

¾

V

Collector Cutoff Current

¾

¾

-0.5

m

A

Emitter Cutoff Current

¾

¾

-0.5

m

A

ON CHARACTERISTICS (Note 2)

DC Current Gain

180

¾

820

¾

Collector-Emitter Saturation Voltage

¾

¾

-0.5

V

SMALL SIGNAL CHARACTERISTICS

Current Gain-Bandwidth Product

¾

140

¾

MHz

f = 100MHz

SOT-26

Dim

Min

Max

Typ

A

0.35

0.50

0.38

B

1.50

1.70

1.60

C

2.70

3.00

2.80

D

¾

¾

0.95

F

¾

¾

0.55

H

2.90

3.10

3.00

J

0.013 0.10

0.05

K

1.00

1.30

1.10

L

0.35

0.55

0.40

M

0.10

0.20

0.15

a

0°

8°

¾

All Dimensions in mm

B

2

B

1

E

1

C

2

E

2

C

1

Notes:

1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which

can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded.

2. Short duration pulse test used to minimize self-heating effect.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

5. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product

manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

Features

SPICE MODEL: IMT4