10

Am29F200B Known Good Die

SU PPL EMEN T

REVISION SUMMARY

Revision A (1997)

Initial release.

Revision B (December 1997)

Formatted for 1998 flash data book.

Revision C (November 1998)

Global

Formatted to match current template. Modified

Am29F200A data sheet for CS39S process technology.

Terms and Conditions

Replaced warranty with new version.

Revision D (December 1998)

Global

Added -75 speed option.

Ordering Information

Changed Gel-Pak quantity to 486. Corrected Surftape

reel size to 7 inches.

Packaging Information

Added section. Moved orientation information from die

photograph section into this section.

Revision D+1 (June 14, 1999)

Physical Specifications

Corrected bond pad dimensions and deleted Si from

the bond pad metalization specification.

Revision D+2 (July 12, 1999)

Global

The device is now available in the high temperature

range (–55

+145

°C.

Revision D+3 (November 17, 1999)

Global

Replaced references to high temperature ratings with a

note to contact AMD for such devices.

Revision D+4 (June 27, 2001)

Manufacturing Information

Added Penang, Malaysia as a test facility (ACN2016).

Trademarks

Copyright © 2001 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.