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SP0502BAHTG 数据表(PDF) 2 Page - Guangdong Youtai Semiconductor Co., Ltd. |
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SP0502BAHTG 数据表(HTML) 2 Page - Guangdong Youtai Semiconductor Co., Ltd. |
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2 / 4 page ![]() Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power ( tp =8/20μs ) PPP 300 Watts Peak Pulse Current ( tp =8/20μs )(note1) Ipp 17 A ESD per IEC 61000-4-2(Air) ESD per IEC 61000-4-2(Contact) VESD 30 30 kV Lead SolderingTemperature TL 260(10seconds) ℃ JunctionTemperature TJ -55 to + 125 ℃ StorageTemperature Tstg -55 to + 125 ℃ ElectricalCharacteristics Parameter Symbol Conditions Min Typical Max Units Reverse Stand-OffVoltage VRWM 5 V Reverse BreakdownVoltage VBR IT=1mA 6.0 7.0 8.5 V Reverse LeakageCurrent IR VRWM=5V,T=25℃ 0.5 1 μA Peak PulseCurrent IPP tp =8/20μs 17 A ClampingVoltage VC IPP=1 0A,tp=8/20μs 1 5 V IPP= 17A,tp=8/20μs 16 V JunctionCapacitance Cj VR = 0V, f =1MHz (pin1、pin2 topin3) 1 50 pF Electrical Parameters (TA = 25°C unless otherwisenoted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current Note:. 8/20μs pulsewaveform. I IF VC VBR VRWM IR VF IT V IPP 12 UMW R www.umw-ic.com 2 UTD Semiconductor Co.,Limited SP0502BAHTG |
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