October 31, 2006 Am29F010B_00_C7

Am29F010B

31

D A TA

SH EE T

REVISION SUMMARY

Revision A (August 12, 1999)

Initial release. Th e Am29 F010 B replaces the

Am29F010A data sheet (22181B+1).

Revision A+1 (September 22, 1999)

Device Bus Operations

Sector Protection/Unprotection: Corrected the publica-

tion number for the programming supplement.

Revision A+2 (September 27, 1999)

Erase and Programming Performance table

In Notes 1 and 6, corrected the erase cycle endurance

to 1 million cycles.

Revision B (November 12, 1999)

AC Characteristics—Figure 9. Program Operations

Timing and Figure 10. Chip/Sector Erase

Operations

high.

Physical Dimensions

Replaced figures with more detailed illustrations.

Revision C (November 28, 2000)

Global

Added table of contents. Removed Preliminary status

from document.

Ordering Information

Deleted burn-in option.

Revision C+1 (November 18, 2002)

Ordering Information

Deleted the PE (PDIP, Extended Temperature Range)

combination from the 45, 55, and 70 ns speed options.

Operating Ranges

Changed Case Temperature to Ambient Temperature.

Revision C+2 (September 22, 2004)

Added PB-Free option to Standard Ordering Matrix.

Updated Valid Combinations

Revision C+3 (April 5, 2005)

Added PE nomenclature to Valid Combinations.

Revision C+4 (August 23, 2005)

Added Pb-free option for PLCC and PDIP packages.

Revision C+5 (January 4, 2006)

Deleted TSR032 32-pin Reverse TSOP option.

Revision C6 (July 27, 2006)

Added notice to first page of data sheet and cover

page.

Revision C7 (October 31, 2006)

Removed notice to first page of data sheet and cover

page.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable

to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products

Trademarks

Copyright ©1997-2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.

Copyright ©2006 Spansion Inc. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are

trademarks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trade-

marks of their respective companies