Radial Lead Transient Voltage Suppressors (TVS)

Revision March 1,2022

www.unsemi.com.tw

For technical questions, contact: tech@unsemi.com.tw

ROHS

Specifications are subject to change without notice.

Please refer to www.unsemi.com.tw for current information.

KB Series

6KA

2/3

Physical Specifications

Flow/Wave Soldering (Solder Dipping)

Weight

Case

Terminal

Contact manufacturer

Epoxy encapsulated

Silver plated leads, solderable per

MIL -STD-750, Method 2026

265°C

10 seconds

1 time

Peak Temperature :

Dipping Time :

Soldering :

Soldering Parameters

Ratings and Characteristic Curves (TA=25°C unless otherwise noted)

Pulse Derating Curve

Ramp up

TS(MAX)

TS(MIN)

Ramp down

Time

Reflow Profile

TP

TL

25

Critical Zone

TL to TP

TL

Time to peak temperature

(t 25℃ to peak)

Ts

Preheat

TP

pd-Lead–free assembly

150°C

200°C

60 -180 Seconds

3°C/second max

5°C/second max

217°C

60 -150 Seconds

260 +0/-5°C

20 - 40 Seconds

6°C/second max

8 minutes Max

280°C

Reflow Condition

Pre Heat

-Temperature Min (Ts(min))

-Temperature Max (Ts(max))

- Time (min to max) (TS)

Average ramp up rate ( Liquidus

Temp TL) to peak

TS(max) to TL - Ramp-up Rate

Reflow

- Temperature (TL) (Liquidus)

- Time (min to max) (TS)

Peak Temperature (TP)

Do not exceed

Time 25°C to peak Temperature (TP)

Time within 5°C of actual peak

Temperature (TP)

Ramp-down Rate

TA-Ambient temperature(°C)

0

25

50

75

100 125 150 175

0

20

40

60

80

100