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PCF1178CU/5 数据表(PDF) 11 Page - NXP Semiconductors |
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PCF1178CU/5 数据表(HTML) 11 Page - NXP Semiconductors |
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11 / 20 page ![]() 1997 Apr 16 11 Philips Semiconductors Product specification 4-digit duplex LCD car clock PCF1178C CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.7 Bonding pad locations, PCF1178CU; 28 terminals. Chip area: 5.61 mm2. Bonding pad dimensions: 110 µm × 110 µm. Chip thickness: 381 ±25 µm. MSB228 0 0 1.92 mm OSC OUT x OSC IN DATA S1 BP1 BP2 AM/PM A2/ADEG1 PCF1178CU FLASH SEL S2 B4/C4 G4/D4 F4/E4 B3/C3 G3/AD3 2.92 mm y |
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