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STTH112 数据表(PDF) 3 Page - STMicroelectronics

部件名 STTH112
功能描述  High voltage ultrafast rectifier
PDF  7 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STTH112 数据表(HTML) 3 Page - STMicroelectronics

  STTH112 Datasheet HTML 1Page - STMicroelectronics STTH112 Datasheet HTML 2Page - STMicroelectronics STTH112 Datasheet HTML 3Page - STMicroelectronics STTH112 Datasheet HTML 4Page - STMicroelectronics STTH112 Datasheet HTML 5Page - STMicroelectronics STTH112 Datasheet HTML 6Page - STMicroelectronics STTH112 Datasheet HTML 7Page - STMicroelectronics  
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STTH112
Electrical characteristics
3/7
Figure 3.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4,
Lleads = 10mm) (DO-41).
Figure 4.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA).
Z/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
δ=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Z/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
T
δ=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Figure 5.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4)(SMB).
Figure 6.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35 µm) (DO-41, SMB).
Figure 7.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, copper
thickness: 35 µm) (SMA).
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Z/R
th(j-c)
th(j-c)
T
δ=tp/T
tp
t (s)
p
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
012
34567
89
10
S(cm²)
DO-41
L
=10mm
leads
SMB
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
S(cm²)
SMA



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