PCF8531 datasheet(39/44 Pages) PHILIPS

39 / 44 page

2000 Feb 11

Philips Semiconductors

Product speciﬁcation

× 128 pixel matrix driver

PCF8531

17 TRAY INFORMATION

handbook, full pagewidth

MGS488

Fig.30 Tray details.

The dimensions are given in Table 13.

Table 13 Dimensions

handbook, halfpage

MGS489

Fig.31 Tray alignment.

The orientation of the IC in a pocket is indicated by the position of

the IC type name on the die surface with respect to the chamfer on

the upper left corner of the tray. Refer to the bonding pad location

diagram for the orientating and position of the type name on the die

surface.

DIM.

DESCRIPTION

VALUE

pocket pitch; x direction

13.72 mm

pocket pitch; y direction

4.17 mm

pocket width; x direction

12.34 mm

pocket width; y direction

2.05 mm

tray width; x direction

50.8 mm

tray width; y direction

50.8 mm

number of pockets in x direction

number of pockets in y direction

PCF8531 数据表(PDF) 39 Page - NXP Semiconductors

PCF8531 数据表(HTML) 39 Page - NXP Semiconductors

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