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MGL759

PC8533-2

C2

C1

F

0, 0

x

y

Fig.22 Bonding pad locations.

The position of the bonding pads is not to scale.

Chip dimensions: approximately 5.40

× 1.51 mm.

Bump dimensions: 90

× 50 × 17.5 µm.

Wafer thickness: 381

µm.