PCF8535 datasheet(49/52 Pages) PHILIPS

49 / 52 page

1999 Aug 24

Philips Semiconductors

Objective speciﬁcation

× 133 pixel matrix driver

PCF8535

16 TRAY INFORMATION

handbook, full pagewidth

MGS691

Fig.29 Tray details.

The dimensions are given in Table 25.

Table 25 Dimensions

handbook, halfpage

MGS692

Fig.30 Tray alignment.

The orientation of the IC in a pocket is indicated by the

position of the IC type name on the die surface with

respect to the chamfer on the upper left corner of the tray.

Refer to the bonding pad location diagram for the

orientating and position of the type name on the die

surface.

DIM.

DESCRIPTION

VALUE

pocket pitch in x direction

14.88 mm

pocket pitch in y direction

4.06 mm

pocket width in x direction

12.76 mm

pocket width in y direction

2.46 mm

tray width in x direction

50.8 mm

tray width in y direction

50.8 mm

number of pockets in x direction

number of pockets in y direction

PCF8535 数据表(PDF) 49 Page - NXP Semiconductors

PCF8535 数据表(HTML) 49 Page - NXP Semiconductors

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