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PCF8558 数据表(PDF) 18 Page - NXP Semiconductors |
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PCF8558 数据表(HTML) 18 Page - NXP Semiconductors |
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18 / 24 page ![]() 1998 Apr 07 18 Philips Semiconductors Objective specification Universal LCD driver for small graphic panels PCF8558 CHIP INFORMATION The PCF8558 is manufactured in p-well CMOS technology. VDD − VLCD is positive. The chip substrate is connected to VDD. Bonding pads Pad pitch 100 µm Pad size, aluminium 80 × 120 µm Bump dimensions 59 × 99 × 15 µm Wafer thickness 381 µm Fig.14 Application, display size 40 × 101 pixels. handbook, halfpage MGG566 DISPLAY 40 × 101 PCF8558 supply, I/O 8 101 20 20 Fig.15 Bonding pads. handbook, halfpage MGG567 4 mm pitch PCF8558 9 mm Y X |
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