PCF8576CUSLASH2 datasheet(35/44 Pages) PHILIPS

35 / 44 page

1998 Jul 30

Philips Semiconductors

Product speciﬁcation

Universal LCD driver for low multiplex

rates

PCF8576C

12.1

Chip-on-glass cascadability in single plane

In chip-on-glass technology, where driver devices are

bonded directly onto glass of the LCD, it is important that

the devices may be cascaded without the crossing of

conductors, but the paths of conductors can be continued

on the glass under the chip. All of this is facilitated by the

PCF8576C bonding pad layout (Fig.30). Pads needing bus

interconnection between all PCF8576Cs of the cascade

are VDD, VSS, VLCD, CLK, SCL, SDA and SYNC. These

lines may be led to the corresponding pads of the next

PCF8576C through the wide opening between VLCD pad

and the backplane output pads.

The only bus line that does not require a second opening

to lead through to the next PCF8576C is VLCD, being the

cascade centre. The placing of VLCD adjacent to VSS

allows the two supplies to be tied together.

When an external clocking source is to be used, OSC of all

devices should be tied to VDD. The pads OSC, A0, A1, A2

and SA0 have been placed between VSS and VDD to

facilitate wiring of oscillator, hardware subaddress and

slave address.

13 BONDING PAD LOCATIONS

Fig.30 Bonding pad locations.

Chip dimensions: approximately 2.92

× 3.20 mm.

Pad area: 0.0121 mm2.

Bonding pad dimensions: 110

× 110 µm.

S33

S32

S31

S29

S30

S28

S26

S25

S27

S24

S23

S22

S20

S21

S19

S18

2.92 mm

SA0

BP0

BP2

BP1

BP3

PCF8576C

LCD

3.20

MBE536

234

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