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PCF8577CT 数据表(PDF) 19 Page - NXP Semiconductors |
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PCF8577CT 数据表(HTML) 19 Page - NXP Semiconductors |
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19 / 28 page ![]() 1998 Jul 30 19 Philips Semiconductors Product specification LCD direct/duplex driver with I2C-bus interface PCF8577C 13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.18 Bonding pad locations. Chip area = 4.62 mm2. Thickness = 381 ±25 µm. n-substrate (back) connected to VDD. Bonding pad dimensions = 110 µm × 110 µm. handbook, full pagewidth MGA726 VDD A2/BP2 BP1 S27 S26 S25 S24 S23 S22 S21 S20 S19 S18 S1 S2 S3 S4 S5 S6 S7 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 54 3 2 1 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 24 25 2.31 mm 2 mm PCF8577C x y 0 0 handbook, halfpage MBE924 Fig.19 Reference marks. |
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