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MF3DX3 数据表(PDF) 21 Page - NXP Semiconductors |
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MF3DX3 数据表(HTML) 21 Page - NXP Semiconductors |
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21 / 29 page  NXP Semiconductors MF3D(H)x3 MIFARE DESFire EV3 contactless multi-application IC References Outline version European projection Issue date IEC JEDEC JEITA SOT500-4 - - - - - - - - - sot500-4_po 11-02-18 Unit mm max nom min 0.26 35.05 35.00 34.95 A(1) Dimensions Note 1. Total package thickness, exclusive punching burr. PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-4 D For unspecified dimensions see PLLMC-drawing given in the subpackage code. 0 10 20 mm scale X D detail X A Figure 5. Package outline SOT500-4 (MOA8) MF3D_H_X3_SDS All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product short data sheet Rev. 3.1 — 11 January 2024 21 / 29 |
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