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AM62A7 数据表(PDF) 235 Page - Texas Instruments |
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AM62A7 数据表(HTML) 235 Page - Texas Instruments |
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235 / 238 page ![]() www.ti.com PACKAGE OUTLINE C 2.556 2.328 0.5 0.3 TYP 16.8 TYP 16.8 TYP 0.8 TYP 0.8 TYP 484X 0.55 0.45 NOTE 3 PIN 1 ID (OPTIONAL) 2.144 1.940 B 18.1 17.9 A 18.1 17.9 (0.6) TYP (0.6) TYP ( 13.6) ( 11.6) ( 17.6) FCBGA - 2.556 mm max height AMB0484A BALL GRID ARRAY 4228703/A 04/2022 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Ball diameter after reflow. Dimension is measured at the maximum solder ball diameter parallel to primary datum C. A B C D E F G H J K L M N P R T U V W Y AA AB BALL A1 CORNER 0.1 C SEATING PLANE 0.2 C 0.2 C 1 2 3 0.25 C A B 0.1 C SYMM SYMM 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 SCALE 0.900 |
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