AM62A7 datasheet(90/238 Pages) TI1

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7.9 Thermal Resistance Characteristics

This section provides the thermal resistance characteristics used on this device.

For reliability and operability concerns, the maximum junction temperature of the device has to be at or below

the TJ value identified in Section 7.4, Recommended Operating Conditions.

7.9.1 Thermal Resistance Characteristics for AMB Package

It is recommended to perform thermal simulations at the system level with the worst case device power consumption.

NO.

PARAMETER

DESCRIPTION

AMB PACKAGE

°C/W(1) (3)

AIR FLOW

(m/s)(2)

RΘJC

Junction-to-case

0.77

N/A

RΘJB

Junction-to-board

3.3

N/A

RΘJA

Junction-to-free air

12.5

Junction-to-moving air

8.6

7.6

7.0

ΨJT

Junction-to-package top

0.39

0.41

0.42

T10

0.43

T11

ΨJB

Junction-to-board

3.1

T12

2.8

T13

2.7

T14

2.6

(1)

These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Packages

(2)

m/s = meters per second.

(3)

°C/W = degrees Celsius per watt.

AM62A7, AM62A7-Q1, AM62A3, AM62A3-Q1

SPRSP77A – MARCH 2023 – REVISED AUGUST 2023

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