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AS7225 数据表(PDF) 10 Page - OSRAM GmbH |
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AS7225 数据表(HTML) 10 Page - OSRAM GmbH |
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10 / 76 page  Document Feedback AS7225 Absolute Maximum Ratings Datasheet • PUBLIC DS000496 • v2-00 • 2019-Jun-28 75 │ 9 4 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device is not designed for high-energy UV (ultraviolet) environments, including upward looking outdoor applications, which could affect long-term optical performance. All voltages with respect to GND. Device parameters are guaranteed at VDD = 3.3 V and TAMB = 25 °C unless otherwise noted. Figure 5 Absolute Maximum Ratings of AS7225 Symbol Parameter Min Typ Max Unit Comments Electrical Parameters VDD1_MAX Supply Voltage VDD1 -0.3 5 V Pin VDD1 to GND VDD2_MAX Supply Voltage VDD2 -0.3 5 V Pin VDD2 to GND VDD_IO Input/Output Pin Voltage -0.3 VDD + 0.3 V Low Voltage pins to GND ISCR Input Current (latch-up immunity) ± 100 mA JESD78D Electrostatic Discharge ESDHBM Electrostatic Discharge HBM ± 1000 V JS-001-2014 ESDCDM Electrostatic Discharge CDM ± 500 V JEDEC JESD22- C101F Oct 2013 Temperature Ranges and Storage Conditions TSTRG Storage Temperature Range -40 85 °C TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD- 020 (1) RHNC Relative Humidity (non- condensing) 5 85 % MSL Moisture Sensitivity Level 3 Represents a 168- hour max. floor lifetime. Bump Temperature (soldering) TPEAK (1) Peak Temperature 235 245 °C Solder Profile (1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is “Matte Tin” (100 % Sn) |
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