AS7263 datasheet(37/46 Pages) OSRAM

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[v4-00] 2022-Nov-30

AS7263 − Storage & Soldering Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 38:

Solder Reflow Profile

Figure 39:

Solder Reflow Profile Graph

Note(s):

1. Not to scale - for reference only.

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217°C

Max 60 s

Time above 230°C

Max 50 s

Time above Tpeak -10°C

Max 10 s

Peak temperature in reflow

Tpeak

260° C

Temperature gradient in cooling

Max -5°C/s

Storage & Soldering

Information

tsoak

Tpeak

Not to scale — for reference only

Time (s)

AS7263 数据表(PDF) 37 Page - OSRAM GmbH

AS7263 数据表(HTML) 37 Page - OSRAM GmbH

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