TCS37715FN datasheet(42/49 Pages) OSRAM

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ams Datasheet

Page 41

[v1-31] 2018-Apr-04

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TCS3771 − Manufacturing Information

The FN package has been tested and has demonstrated an

ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat

exposure of components during the solder reflow process of

product on a PCB. Temperature is measured on top of

component. The components should be limited to a maximum

of three passes through this solder reflow profile.

Figure 49:

TCS3771 Solder Reflow Profile

Figure 50:

Solder Reflow Profile Graph

Note(s):

1. Not to scale - for reference only.

Parameter

Reference

TCS3771

Average temperature gradient in preheating

2.5°C/sec

Soak time

tsoak

2 to 3 minutes

Time above 217°C (T1)

Max 60 sec

Time above 230°C (T2)

Max 50 sec

Time above Tpeak - 10°C (T3)

Max 10 sec

Peak temperature in reflow

Tpeak

260° C

Temperature gradient in cooling

Max -5°C/sec

Manufacturing Information

TCS37715FN 数据表(PDF) 42 Page - OSRAM GmbH

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