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TMF8701 数据表(PDF) 56 Page - OSRAM GmbH |
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TMF8701 数据表(HTML) 56 Page - OSRAM GmbH |
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56 / 66 page  Datasheet, Public Page 55 [v2-00] 2023-Feb-21 Document Feedback TMF8701 − Soldering & Storage Information Soldering Information The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 121: Solder Reflow Profile Graph Soldering & Storage Information |
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