Data Sheet

ADAR5001

OUTLINE DIMENSIONS

©2024 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

One Analog Way, Wilmington, MA 01887-2356, U.S.A.

Rev. 0 | 9 of 9

SEATING

PLANE

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.300

Ø

0.260

0.220

1.500

1.460 SQ

1.420

A

1

2

3

B

C

0.40

BSC

0.35

REF

0.80

REF

0.560

0.500

0.440

0.230

0.200

0.170

0.330

0.300

0.270

COPLANARITY

0.05

BALL A1

IDENTIFIER

Figure 14. 8-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-8-8)

Dimensions shown in millimeters

Updated: February 17, 2024

ORDERING GUIDE

Model1

Temperature Range

Package Description

Packing Quantity

Package

Option

ADAR5001ACBZ

−40°C to +85°C

CHIPS W/SOLDER BUMPS/WLCSP

Reel, 1

CB-8-8

ADAR5001ACBZ-R7

−40°C to +85°C

CHIPS W/SOLDER BUMPS/WLCSP

Reel, 3000

CB-8-8

1 Z = RoHS Compliant Part.

EVALUATION BOARDS

Table 5. Evaluation Boards

Model1

Description

ADAR5001-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.