5 / 5 page
29
THINKING ELECTRONIC
Item
Test Conditions/Methods
Gradually applying the force specified below to each terminal and keeping the unit fixed
for 10 1 sec .
Tensile
Strength of
Terminations
Bending
Strength of
Terminations
Damp Heat
Specifications
No visible damage
No visible damage
Terminal diameter
(mm)
0.3<d
0.5
0.5<d
0.8
Force
(Kg)
0.5
1.0
Terminal diameter
(mm)
0.3<d
0.5
0.5<d
0.8
0.25
0.5
Force
(Kg)
Hanging the force specified below to each terminal and gradually bending each terminal by 90
in one direction, then 90 in the opposite direction, and again back to the origin.
The thermal shock conditions shown below shall be repeated 5 cycles
1
2
3
4
Step
Temperature (
)
-30 5
Room temperature
125 5
Room temperature
Period (minutes)
30
30
3
3
5 3
5 3
Solderability
Resistance to
Soldering
Heat
At least 95% of terminal
electrode is covered by
new solder
Life Test
No visible damage
R/R
5 %
No visible damage
R/R
3%
No visible damage
R/R
3 %
No visible damage
R/R
3 %
25 5
, Pmax X 1000 HRS
235 5
, 2 0.5 sec
26 0 5
, 10 1 sec
40
2
, 9 0 ~ 95 % RH ,1000 24 HRS
Thermal
Shock
Reliability test
Current(mA)
TTC05102~TTC05104
10000
5000
2000
1000
200
500
100
50
20
10
5
2
1
0.5
0.2
0.1
1000
500
200
100
50
20
10
5
2
1
P RO D U C T DATA
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
