DATA SHEET

SE2564L: 2.4 GHz High Efficiency Wireless LAN Front-End

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202423A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012

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Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. The SE2564L is capable of

withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or

in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that

the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For

details on both attachment techniques, precautions, and handling procedures recommended, please refer to:



“Quad Flat No-Lead Module Solder Reflow & Rework Information”, Document Number QAD-00045



“Handling, Packing, Shipping and Use of Moisture Sensitive QFN”, Document Number QAD-00044



“ESD Control Policy”, Document Number SQ03-0062

Branding Information

Figure 6: SE2564L Branding and Pin 1 Location

SiGe

2564L

Lot

Lot Code

Part

Pin 1 Designator

Pin 1

E3

Terminal Finish

Caution! Class 0 ESD sensitive device