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STLD20D 数据表(PDF) 23 Page - STMicroelectronics |
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STLD20D 数据表(HTML) 23 Page - STMicroelectronics |
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23 / 31 page ![]() STLD20D Layout recommendation 23/31 10 Layout recommendation The package connection of the STLD20D has been realized in order to facilitate the layout of the PCB. The golden rule to obtain an optimized layout is to split the power and signal track as shown on the Figure 24. It is necessary to place the input capacitor as closed as possible between pin1 and pin2 of the STLD20D package. If the CIN capacitor is not closed to the device, high frequency noise due to gate driver dI/dt flows through the copper track of the board and can generate some line voltage drop due to the line inductance. For the same reason, in order to eliminate high frequency current loop, the connection of the diode (D) and the output capacitor (COUT) must be as close as possible to the internal power MosFET (SW) (close to pin 8 and 1). Concerning the signal path, we recommend to create the PCB GND signal from the pin 1 ("A" point in the Figure 24.). Thus all signal references such as feedback and the voltage across Rset are not disturbed by the power stage. Figure 24. Layout suggested A GND VIN COUT 12 8 D L STLD20D CIN RSET SHDN RLED |
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