GaAs SP4T Switch

DC - 4.0 GHz

MASW4060G

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no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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V3

2

RoHS

Compliant

Electrical Specifications: 0/-5 Vdc, 50

Parameter

Test Conditions

Units

Min.

Typ.

Max.

Insertion Loss

DC - 0.5 GHz

DC - 1.0 GHz

DC - 2.0 GHz

DC - 4.0 GHz

dB

dB

dB

dB

—

—

—

—

—

—

—

—

1.3

1.3

1.3

1.7

Isolation

DC - 0.5 GHz

DC - 1.0 GHz

DC - 2.0 GHz

DC - 4.0 GHz

dB

dB

dB

dB

50

45

40

30

—

—

—

—

—

—

—

—

VSWR

DC - 0.5 GHz

DC - 1.0 GHz

DC - 2.0 GHz

DC - 4.0 GHz

Ratio

Ratio

Ratio

Ratio

—

—

—

—

—

—

—

—

1.4:1

1.4:1

1.5:1

2.0:1

Input P-1dB

0.5 GHz

0.5 - 4.0 GHz

dBm

dBm

—

—

+17

+27

—

—

IP2

Two Tone Input Power up to +5 dBm

0.5 GHz

0.5 - 4.0 GHz

dBm

dBm

—

—

+45

+60

—

—

IP3

Two Tone Input Power up to +5 dBm

0.5 GHz

0.5 - 4.0 GHz

dBm

dBm

—

—

+35

+46

—

—

Control Current

µA

µA

—

—

—

50

25

200

T-rise, T-fall

10% to 90% RF and 90% to 10% RF

nS

—

2

—

50% control to 90% RF, and 50% control to 10% RF

nS

—

4

—

Transients

In Band

mV

—

20

—

Truth Table

7

A1

B3

A4 B4

ANT-

RF1

ANT-

RF2

ANT-

RF3

ANT-

RF4

1

1

0

1

On

Off

Off

Off

0

1

0

1

Off

On

Off

Off

0

0

0

1

Off

Off

On

Off

0

1

1

0

Off

Off

Off

On

B1

0

1

1

1

A2

0

1

0

0

B2

1

0

1

1

A3

0

0

1

0

7. 0 = 0 V to –0.2 V, 1 = -5 V.

Wire Bonding

A. Ball or wedge with 1.0 mil diameter pure gold

wire. Thermosonic wirebonding with a nominal

stage temperature of 150°C and a ball bonding

force of 40 to 50 grams or wedge bonding force

of 18 to 22 grams is recommended. Ultrasonic

energy and time should be adjusted to the

minimum levels achieve reliable wirebonds.

B. Wirebonds should be started on the chip and

terminated on the package.

GND bonds

should be as short as possible; at least three

and no more than four bond wires from ground

pads to package are recommended.

Handling Procedures

Please observe the following precautions to avoid

damage:

Static Sensitivity

Gallium Arsenide Integrated Circuits are sensitive

to electrostatic discharge (ESD) and can be

damaged by static electricity. Proper ESD control

techniques should be used when handling these

devices.

6. Loss changes ±0.0025 dB/°C. (From -55°C to +85°C)