Surface Mount

Plastic PIN Diodes

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product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

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Visit www.macom.com for additional data sheets and product information.

9

V16

SMPP Series

Also Offering

RoHS Compliant

Equivalent Parts

Mounting Information

The

illustration

indicates

the

recommended

mounting pad configuration for the SOT-23,

SOT-323 , SOD-323, SOT-143, and SC-79

packages. Solder paste containing flux should be

screened onto the pads to a thickness of 0.005-

0.007 inches. The plastic package is placed in

position, firmly adhering to the solder paste.

Permanent attachment is performed by a reflow

soldering

procedure

during

which

the

tab

temperature does not exceed +275

°C and the

body temperature does not exceed +250

°C, for

standard models and +260

°C for the RoHS

compliant devices.

Please refer to Application Note M538 for

surface mounting instructions.

0.75

1.9

.037

0.95

.035

0.90

.090

2.2

.030

0.80

inches

mm

Dimenstions:

min.

min.

SOT-23

SOT-323

0.030

0.80

0.030

0.80

0.030

0.80

0.075

1.9

0.030

0.80

inches

mm

Dimenstions:

SOD-323

0.030

0.80

.090

2.2

0.030

0.80

inches

mm

Dimenstions:

0.030

0.80

SOT-143

0.035

0.89

0.115

2.92

0.045

1.17

0.045

1.14

0.030

0.76

inches

mm

Dimenstions:

0.045

1.14

0.106

2.69

0.031

0.79

SC-79

0.020

0.50

0.053

1.35

inches

mm

Dimenstions:

0.020

0.50