SE2521A60

RangeCharger™ 2.4 GHz Wireless LAN Front End

177-DST-01 Rev 1.4 Apr-04-2006

Confidential

13 of 16

QA040406

Package Information

Figure 17 shows the detailed device package diagram. The pads on the SiGe RF modules are plated with gold over

nickel, with a gold thickness of approx. 0.75 to 1.0 um. The modules can be reflowed onto FR4 based material using

eutectic Pb based or common tin based Pb free solder pastes.

TOP SIDE

BOTTOM SIDE

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GND

GND

GND

GND

GND

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321

GND

GND

GND

GND

GND

GND

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GND

GND

GND

GND

GND

GND

GNDGND

GNDGND

GND

GND

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GND

GND

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GND

GND

GND

GND

GND

SIGNAL PAD

DETAIL

GROUND PAD

DETAIL

NOTES :

Figure 17: SE2521A60 Package Diagram

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. The SE2521A60 is capable of

withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or

in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that

the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For

details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to:

SiGe’s Application Note: “Land Grid Array Module Solder Reflow & Rework Information”, Document Number 69-

APP-01

.

SiGe’s Application Note: “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number

69-APP-02

.