DATA SHEET

SE2613T: 2.4 GHz Front-End for Wireless LAN and Bluetooth® Applications

Skyworks Solutions, Inc. • Phone [949] 231-3000 • sales@skyworksinc.com • www.skyworksinc.com

202406C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 6, 2022

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Recommended PCB Footprint and Solder Pattern

Figure 5: PCB Footprint and Solder Pattern

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed regarding

exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder assembly. The SE2613T is capable of withstanding a Pb free

solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow

environment. If the part is manually attached, precaution should be taken to ensure the device is not subjected to

temperatures above its rated peak temperature for an extended period of time. For details on both attachment techniques,

precautions, and handling procedures recommended, please refer to:



“QFN solder reflow and rework information application note”, Document Number QAD-00045



“Handling, packing, shipping and use of moisture sensitive QFN application note”, Document Number QAD-

00044

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