Analog Integrated Circuit Device Data

Freescale Semiconductor

5

34652

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Peak Package Reflow Temperature During Reflow (5), (6)

Note 6

°C

Thermal Resistance (7)

, (8)

Junction-to-Ambient, Single-Layer Board (9)

Junction-to-Ambient, Four-Layer Board (10)

103

65

°C/W

Notes

5.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

6.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

7.

Refer to the section titled Thermal Shutdown on page 16 for more thermal resistance values under various conditions.

8.

The VOUT and VIN pins comprise the main heat conduction paths.

9.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

10.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the

board.

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS