LSDB3 datasheet(1/3 Pages) MCC

部件名	LSDB3

功能描述	SILICON BIDIRECTIONAL DIAC

PDF	3 Pages

Scroll/Zoom	100%

制造商	MCC [Micro Commercial Components]

网页	http://www.mccsemi.com

标志

1 / 3 page

Maximum Ratings

Operating JunctionTemperature: -40

oC to +125oC

Storage Temperature: -40

oC to +125oC

Electrical Characteristics @ 25

oC Unless Otherwise Specified

NOTES:1.Electrical characteristics applicable in both forward and

reverse directions.

2.Connected in parallel with the devices.

SILICON

BIDIRECTIONAL

DIAC

Power dissipation

on Printed

Circuit(l=10mm)

PC

150mW

T

A=50

oC

Repetitive Peak

on-state Current

ITRM

2.0A

p

VBO

C=22nF(Note 2)

Breakover Voltage

Symmetry

|+VBO|

C=22nF(Note 2)

Output

Voltage(Note 1)

V

o(min)

5V

Breakover

Current(Note 1)

IBO(max)

50uA

C=22nF

Rise Time(Note 1)

Tr

2.0us

Leakage

Current(Note 1)

IB(max)

10uA

VB=0.5VBO(max)

omponents

20736 Marilla

Street Chatsworth

!"#

$% !"#

MCC

Revision: 1

2006/11/21

Breakover Voltage: 32V

Breakover Voltage Range: 28V to

36V

LSDB3

Features

Min Typ Max

28 32 36V

±3V

Breakover Voltage

=20us,f=120Hz

t

TM

Micro Commercial Components

Quadro MELF

SUGGESTED SOLDER

PAD LAYOUT

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.130

.146

3.30

3.70

B

.008

.016

.20

.40

C

.055

.063

1.40

1.60

∅

D

.067

1.70

.155”

.022”

.065”

A

B

Cathode Mark

C

D

www.mccsemi.com

1 of 3

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