Analog Integrated Circuit Device Data

Freescale Semiconductor

9

17529

APPLICATIONS

FUNCTIONAL TERMINAL DESCRIPTION

APPLICATIONS

TYPICAL APPLICATION

Figure 7 shows a typical application for the 17529. When

external source, be sure to connect it via a resistor equal to,

The internal charge pump of this device is generated from

the VDD supply; therefore, care must be taken to provide

sufficient gate-source voltage for the high-side MOSFETs

ensure full enhancement of the high-side MOSFET channels.

Figure 7. 17529 Typical Application Diagram

CONDUCTED ELECTROMOTIVE FORCE (CEMF)

SNUBBING TECHNIQUES

Care must be taken to protect the IC from potentially

damaging CEMF spikes induced when commutating currents

in inductive loads. Typical practice is to provide snubbing of

voltage transients by placing a capacitor or zener at the

supply terminal (VM) (see Figure 8).

Figure 8. CEMF Snubbing Techniques

PCB LAYOUT

When designing the printed circuit board (PCB), connect

sufficient capacitance between power supply and ground

terminals to ensure proper filtering from transients. For all

high-current paths, use wide copper traces and shortest

possible distances.

MCU

17529

5.0 V

GND

C1L

C1H

C2L

C2H

IN1B

IN2A

IN2B

OE

VM

VDD

OUT1B

OUT2B

0.01 µF

OUT1A

IN1A

OUT2A

NC

NC

NC

NC

VC

VC

NC = No Connect

175XX

5.0 V

5.0 V

GND

C1L

C1H

C2L

C2H

VM

VDD

OUT

OUT

175XX

5.0 V

5.0 V

GND

C1L

C1H

C2L

C2H

CRES

VM

VDD

OUT

OUT

CRES

This paragraph is boilerplate - you may add to it but, can not change wording. You may change numeric values