MPC8555VTALD datasheet(13/88 Pages) FREESCALE

13 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Power Characteristics

2. Junction temperature is a function of die size, on-chip power dissipation, package thermal

resistance, mounting site (board) temperature, ambient temperature, air flow, power

dissipation of other components on the board, and board thermal resistance. Any customer

design must take these considerations into account to ensure the maximum 105 degrees

junction temperature is not exceeded on this device.

3. Typical power is based on a nominal voltage of VDD = 1.2V, a nominal process, a junction

temperature of Tj = 105° C, and a Dhrystone 2.1 benchmark application.

4. Thermal solutions will likely need to design to a value higher than Typical Power based on

the end application, TA target, and I/O power

5. Maximum power is based on a nominal voltage of VDD = 1.2V, worst case process, a junction

temperature of Tj = 105° C, and an artificial smoke test.

6. The nominal recommended VDD = 1.3V for this speed grade.

Table 5. Typical I/O Power Dissipation

Interface

Parameters

GVDD

(2.5V)

OVDD

(3.3V)

LVDD

(3.3V)

LVDD

(2.5V)

Unit

Comments

DDR I/O

CCB = 200 MHz

0.46

—

CCB = 266 Mhz

0.59

—

CCB = 300 Mhz

0.66

—

CCB = 333 Mhz

0.73

—

PCI I/O

64b, 66Mhz

0.14

—

64b, 33Mhz

0.08

—

32b, 66Mhz

0.07

Multiply by 2 if using two 32b ports

32b, 33Mhz

0.04

Local Bus I/O

32b, 167Mhz

0.30

—

32b, 133Mhz

0.24

—

32b, 83Mhz

0.16

32b, 66Mhz

0.13

—

32b, 33Mhz

0.07

—

TSEC I/O

MII

0.01

Multiply by number of interfaces

used.

GMII or TBI

0.07

RGMII or RTBI

0.04

CPM - FCC

MII

0.015

—

RMII

0.013

—

HDLC 16 Mbps

0.009

—

UTOPIA-8 SPHY

0.06

—

UTOPIA-8 MPHY

0.1

—

UTOPIA-16 SPHY

0.094

—

UTOPIA-16 MPHY

0.135

—

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