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MPC8280VRM 数据表(PDF) 59 Page - Freescale Semiconductor, Inc |
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MPC8280VRM 数据表(HTML) 59 Page - Freescale Semiconductor, Inc |
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59 / 80 page  MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 Freescale Semiconductor 59 Pinout Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view. Figure 16. Side View of the PBGA Package Remove NOTE: Temperature Reflow for the VR Package In the VR package, sphere composition is lead-free (refer to Table 2). This requires higher temperature reflow than what is required for other PowerQUICC II packages. Users should consult “Freescale PowerQUICC II™ Pb-Free Packaging Information” (MPC8250PBFREEPKG) available at www.freescale.com. Table 23 shows the pinout list of the MPC8275 and MPC8270. Table 22 defines conventions and acronyms used in Table 23. Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List Pin Name Ball MPC8275/MPC8270 MPC8275 only BR C16 BG D2 ABB/IRQ2 C1 TS D1 A0 D5 A1 E8 A2 C4 A3 B4 A4 A4 A5 D7 A6 D8 A7 C6 A8 B5 A9 B6 A10 C7 Die Transfer molding compound 1 mm pitch Wire bonds attach DIE Ball bond Screen-printed solder mask Cu substrate traces BT resin glass epoxy Plated substrate via |
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