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MPC8280VRP 数据表(PDF) 44 Page - Freescale Semiconductor, Inc |
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MPC8280VRP 数据表(HTML) 44 Page - Freescale Semiconductor, Inc |
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44 / 80 page ![]() MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7 44 Freescale Semiconductor Pinout Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view. Figure 14. Side View of the TBGA Package Table 21 shows the pinout list of the MPC8280 and MPC8270. Table 22 defines conventions and acronyms used in Table 21. Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List Pin Name Ball MPC8280/MPC8270 MPC8280 only BR W5 BG F4 ABB/IRQ2 E2 TS E3 A0 G1 A1 H5 A2 H2 A3 H1 A4 J5 A5 J4 A6 J3 A7 J2 A8 J1 A9 K4 A10 K3 A11 K2 A12 K1 A13 L5 A14 L4 A15 L3 A16 L2 Soldermask Copper Traces Die Copper Heat Spreader (Oxidized for Insulation) 1.27 mm Pitch Glob-Top Dam Wire Bonds Etched Pressure Sensitive Die Glob-Top Filled Area Polymide Tape Cavity Adhesive Attach View |
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