MPX2202

Sensors

Freescale Semiconductor

5

Figure 4. Cross-Sectional Diagrams (Not to Scale)

Figure 4 illustrates an absolute sensing die (right) and the

differential or gauge die in the basic chip carrier (Case 344).

A silicone gel isolates the die surface and wire bonds from the

environment, while allowing the pressure signal to be

transmitted to the silicon diaphragm.

The MPX2202/MPXV2202G series pressure sensor

operating characteristics and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media other than dry air may have adverse effects on

sensor performance and long term reliability. Contact the

factory for information regarding media compatibility in your

application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing the silicone gel

which isolates the die from the environment. The differential

or gauge sensor is designed to operate with positive

differential pressure applied, P1 > P2. The absolute sensor is

designed for vacuum applied to P1 side.

The Pressure (P1) side may be identified by using the

table below:

Lead Frame

Wire Bond

Differential/gauge

Die

Silicone Gel

Die Coat

Differential/Gauge Element

P2

DIE

Bond

Epoxy

Case

Stainless Steel

Metal Cover

P1

Silicone Gel

Die Coat

Absolute

Die

P1

Metal Cover

Epoxy

Case

Absolute Element

P2

Lead Frame

Wire Bond

Die

Bond

Stainless Steel

Table 3. Pressure (P1)/Vacuum (P2) Side Identification

Table

Part Number

Case Type

Pressure (P1) Side

Identifier

MPX2202A/D

344

Stainless Steel Cap

MPX2202DP

344C

Side with Part Marking

MPX2202AP/GP

344B

Side with Port Attached

MPX2202ASX

344F

Side with Port Attached

MPXV2202GP

1369

Side with Port Attached

MPXV2202DP

1351

Side with Part Marking