2003 Feb 24

9

Philips Semiconductors

Product specification

UHF power LDMOS transistor

BLF2022-70

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT502A

99-12-28

03-01-10

0

5

10 mm

scale

Flanged LDMOST ceramic package; 2 mounting holes; 2 leads

SOT502A

p

L

A

F

b

D

U2

H

Q

c

1

3

2

D1

E

A

C

q

U1

C

B

E1

M

M

w2

UNIT

A

mm

D

b

12.83

12.57

0.15

0.08

20.02

19.61

9.53

9.25

19.94

18.92

9.91

9.65

4.72

3.43

c

U2

0.25

0.51

27.94

qw2

w1

F

1.14

0.89

U1

34.16

33.91

L

5.33

4.32

p

3.38

3.12

Q

1.70

1.45

EE1

9.50

9.30

inches

0.505

0.495

0.006

0.003

0.788

0.772

D1

19.96

19.66

0.786

0.774

0.375

0.364

0.785

0.745

0.390

0.380

0.186

0.135

0.01

0.02

1.100

0.045

0.035

1.345

1.335

0.210

0.170

0.133

0.123

0.067

0.057

0.374

0.366

H

DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

w1

AB

M

M

M