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MP7722DF 数据表(PDF) 9 Page - Monolithic Power Systems |
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MP7722DF 数据表(HTML) 9 Page - Monolithic Power Systems |
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9 / 11 page ![]() MP7722 – 2 x 20W CLASS D STEREO SINGLE ENDED AUDIO AMPLIFIER MP7722 Rev. 1.3 www.MonolithicPower.com 9 9/25/2006 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2006 MPS. All Rights Reserved. PCB Layout The circuit layout is critical for optimum performance and low output distortion and noise. Place the following components as close to the MP7722 as possible: Power Supply Bypass, CBYP CBYP1 and CBYP2 carry the transient current for the switching power stage. To prevent overstressing of the MP7722 and excessive noise at the output, place CBYP1 as close to pins 18 (VDD1) and 20 (PGND1) as possible and also place CBYP2 as close to pins 13 (VDD2) and 15 (PGND2) as possible. Output Catch Diodes DSH1, DSL1, DSH2 and DSL2 carry the current over the dead-time while the MOSFET switches are off. Place the diodes as close to the MP7722 as possible. Timing Capacitors CINT1 and CINT2 are used to set the amplifier switching frequencies and are typically on the order of a few nF. Place CINT1 as close to pins 2 and 3 as possible to reduce distortion and noise. Likewise, place CINT2 as close to pins 7 and 8 as possible. Reference Bypass Capacitors CR1 and CR2 filter the ½ VDD reference voltages. Place CR1 and CR2 as close to the IC as possible to improve power supply rejection and reduce distortion and noise at the output. When laying out the PCB, use two separate ground planes, analog ground (AGND) and power ground (PGND), and connect the two grounds together at a single point to prevent noise injection into the amplifier input to reduce distortion. Make sure that any traces carrying the switch node (SW) voltages are separated far from any input signal traces. If it is required to run the SW trace near the input, shield the input with a ground plane between the traces. For multiple channel applications, make sure that each channel is physically separated to prevent crosstalk. Make sure that all inductors used on a single circuit board have the same orientation. Also, make sure that the power supply is routed from the source to each channel individually, not serially. This prevents channel-to-channel coupling through the power supply input. Electro-Magnetic Interference (EMI) Considerations Due to the switching nature of the Class D amplifier, care must be taken to minimize the effects of electromagnetic interference from the amplifier. However, with proper component selection and careful attention to circuit layout, the effects of the EMI due to the amplifier switching can be minimized. The power inductors are a potential source of radiated emissions. For the best EMI performance use toroidal inductors, since the magnetic field is well contained inside the core. However toroidal inductors can be expensive to wind. For a more economical solution, use shielded gapped ferrite or shielded ferrite bobbin core inductors. These inductors typically do not contain the field as well as toroidal inductors, but usually can achieve a better balance of good EMI performance with low cost. The size of high-current loops that carry rapidly changing currents needs to be minimized. To do this, make sure that the VDD bypass capacitors and the Schottky Catch diodes are as close to the MP7722 as possible. Nodes that carry rapidly changing voltages, such as SW, need to be made as small as possible. If sensitive traces run near a trace connected to SW, place a ground shield between the traces. |
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