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ADRF5532BCPZN-R7 数据表(PDF) 10 Page - Analog Devices

部件名 ADRF5532BCPZN-R7
功能描述  2.3 GHz to 2.7 GHz, Receiver Front End
PDF  11 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADRF5532BCPZN-R7 数据表(HTML) 10 Page - Analog Devices

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Data Sheet
ADRF5532
APPLICATIONS INFORMATION
analog.com
Rev. A | 10 of 11
The ADRF5532 has a single power-supply pin (VCC) and one
control pin (T/R). Figure 17 shows the external components and
connections for supply and control pins. The VCC pin is decoupled
with a 100 pF multilayer ceramic capacitor and a 4.7 μF capacitor.
The T/R pin is decoupled with a 100 pF multilayer ceramic capac-
itor. The device pinout allows the placement of the decoupling
capacitors close to the device. The RF pins (ANT, TERM, RXOUT)
do not require external DC blocking capacitors; all pins are pulled
down to 0 V DC with high impedance. See Table 5 for details.
Figure 17. Recommended Schematic
RECOMMENDATIONS FOR PRINTED CIRCUIT
BOARD DESIGN
The RF ports are matched to 50 Ω internally and the pin-out is
designed to mate a coplanar waveguide (CPWG) with 50 Ω charac-
teristic impedance on the PCB. Figure 18 shows the referenced
CPWG RF trace design for an RF substrate with 10 mil thick
Rogers RO4350 dielectric material. RF trace with 18 mil width
and 13 mil clearance is recommended for 2.7 mil finished copper
thickness.
Figure 18. Example PCB Stack-Up
Figure 19 shows the routing of the RF traces, supply, and control
signals from the device. The ground planes are connected with as
many filled, through vias as allowed for optimal RF and thermal
performance. The primary thermal path for the device is the bottom
side.
Figure 19. PCB Routings
Figure 20 shows the recommended layout from the device RF pins
to the 50 Ω CPWG on the referenced stack-up. The ground pads
are drawn solder mask defined and the signal pads are drawn as
pad defined. The RF trace from the PCB pad is extended with
the same width and tapered to the RF trace with a 45° angle.
The paste mask is also designed to match the pad without any
aperture reduction. The paste is divided into multiple openings for
the paddle.
Figure 20. Recommended RF Pin Transitions
For further recommendations on alternate PCB stack-ups with
different dielectric thickness and CPWG design, contact Analog
Devices Technical Support.



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