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PDS-002895 Rev 04

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Luminus Devices, Inc. • T 408.708.7000 • www.luminus.com

1145 Sonora Court • Sunnyvale, CA 94086

SST-10-Red

Product Datasheet

Notes

1. Product complies to Moisture Sensitivity Level 1 (MSL 1).

2. The numbers in the table are specific to SAC305. Luminus recommends using an SAC305 solder paste with a no-clean flux for RoHS compliant

products.

3. During the pick and place process, axial forces on the dome (or window) should not exceed 0.5 Newtons (N).

4. Use of a multi-zone IR reflow oven with a nitrogen blanket is recommended.

5. Time-temperature profile of the reflow process showing the four functional profile zones are defined in IPC-7801. Temperature is referenced to the

center of the PCB.

6. Luminus recommends to use the solder paste data sheet information as a starting point in time-temperature process development.

7. These are general guidelines. Consult the solder paste manufacturer’s datasheet for guidelines specific to the alloy and flux combination used in

your application. For more information, please refer to:

https://luminusdevices.zendesk.com/hc/en-us/articles/360060306692-How-do-I-Reflow-Solder-Luminus-SMD-Components-

8. For any technical questions about soldering process, please contact Luminus at techsupport@luminus.com.

SMT Rework Guideline

Manual Hotplate Reflow

Hot Air Gun Reflow

Heating Time

< 60 sec

Hotplate Temperature

< 245°C

< 150°C

Time

Preheat

RT to 150°C

1 - 2.5°C/sec

Soak

150°C to 180°C

0.4 - 1°C/sec

Reflow

180 to TL + 20°C

3 - 6°C/sec

Cool down

Peak to below 150°C

3 - 7°C/sec

Liquidus Temperature, TL (SAC305 = 220°C)

Peak Temperature (235 - 245°C)

Time Above Liquidus

(45 - 90 sec)

65 -> 200°C, 120 - 250 sec max

Soldering Profile