4

4 - 35

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20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Pad Number

Function

Description

Interface Schematic

1, 4, 7

RF1, RFC, RF2

This pin is DC coupled and matched to 50 Ohm. Blocking

capacitors are required if RF line potential is not equal to 0V.

2, 10

B

See truth table and control voltage table.

Alternate A & B control pads provided.

3, 11

B

5, 8

A

6, 9

A

Die Bottom

GND

Die bottom must be connected to RF ground.

Outline Drawing

NOTES:

1. PACKAGE BODY MATERIAL: WHITE ALUMINA 92%

2. CONDUCTOR TRACES MATERIAL: THICK FILM TUNGSTEN.

3. LEAD, BASE, COVER MATERIAL: KOVAR™.

4. PLATING: ELECTROLYTIC GOLD 50 MICROINCHES MIN, OVER

ELECTROLYTIC NICKEL 50 MICROINCHES MIN.

5. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

6. TOLERANCES: .±005 [0.13] UNLESS OTHERWISE SPECIFIED.

7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED

TO PCB RF GROUND.

Pad Descriptions

HMC607

GaAs MMIC HIGH ISOLATION

SPDT SWITCH, DC - 15 GHz

v00.0307