IRFE9130

2

www.irf.com

Thermal Resistance

Parameter

Min Typ Max Units

Test Conditions

RthJC

Junction to Case

—

—

5.0

RthJ-PCB

Junction to PC Board

—

—

19"""

Soldered to a copper clad PC board

°C/W

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ Max Units

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

-6.5

ISM

Pulse Source Current (Body Diode) ➀

—

—

-25

VSD

Diode Forward Voltage

—

—

-4.3

V

trr

Reverse Recovery Time

—

—

250

nS

Tj = 25°C, IF = -6.5A, di/dt ≤-100A/µs

QRR

Reverse Recovery Charge

—

—

3.0

µc

VDD ≤ -50V ➃

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

A

For footnotes refer to the last page

Parameter

Min

Typ Max Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

-100

—

—

V

VGS = 0V, ID = -1.0mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown

—

-0.10

—

V/°C

Reference to 25°C, ID = -1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

—

—

0.30

VGS = -10V, ID = -4.1A➃

Resistance

—

—

0.345

VGS = -10V, ID = -6.5A ➃

VGS(th)

Gate Threshold Voltage

-2.0

—

-4.0

V

VDS = VGS, ID = -250µA

gfs

Forward Transconductance

1.9

—

—

S ( )

VDS > -15V, IDS = -4.1A➃

IDSS

Zero Gate Voltage Drain Current

—

—

-25

VDS= -80V, VGS= 0V

—

—

-250

VDS = -80V

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

-100

VGS =-20V

IGSS

Gate-to-Source Leakage Reverse

—

—

100

VGS =20V

Qg

Total Gate Charge

—

—

3 5

VGS =-10V, ID= -6.5A

Qgs

Gate-to-Source Charge

—

—

6.8

nC

VDS =-50V

Qgd

Gate-to-Drain (‘Miller’) Charge

—

—

2 3

Turn-On Delay Time

—

—

6 0

VDD =-50V, ID = -6.5A,

t r

Rise Time

—

—

140

RG =7.5Ω

Turn-Off Delay Time

—

—

140

tf

Fall Time

—

—

140

LS + LD

Total Inductance

—

—

Ciss

Input Capacitance

—

790

VGS = 0V, VDS = -25V

Coss

Output Capacitance

—

340

—

pF

f = 1.0MHz

Crss

Reverse Transfer Capacitance

—

7 1

—

nA

nH

ns

µA

Ω

Measured from the center of

drain pad to center of source

pad