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DF2S16ASL 数据表(PDF) 2 Page - Toshiba Semiconductor |
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DF2S16ASL 数据表(HTML) 2 Page - Toshiba Semiconductor |
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2 / 8 page ![]() DF2S16ASL 2 4. Electrical Characteristics (Unless otherwise specified, Ta = 25�) VRWM: Working peak reverse voltage VZ: Zener voltage VBR: Reverse breakdown voltage ZZ: Dynamic impedance IZ: Zener current IBR: Reverse breakdown current IR: Reverse current VR: Reverse voltage VC: Clamp voltage IPP: Peak pulse current RDYN: Dynamic resistance IF: Forward current VF: Forward voltage Fig. 4.1 Definitions of Electrical Characteristics Characteristics Working peak reverse voltage Zener voltage (Reverse breakdown voltage) Dynamic impedance Reverse current Clamp voltage Dynamic resistance Total capacitance Symbol VRWM VZ (VBR) ZZ IR VC RDYN Ct Note (Note 1) (Note 2) (Note 2) (Note 3) Test Condition � IZ = 5 mA (IBR = 5 mA) IZ = 5 mA (IBR = 5 mA) VRWM = 12 V IPP = 1 A IPP = 2.5 A ITLP = 16 A ITLP = 30 A � VR = 0 V, f = 1 MHz Min � 15.3 � � � � � � � � Typ. � 16.0 � � 22 28 34 55 0.6 10 Max 12 17.1 35 0.5 � 35 � � � � Unit V V Ω µA V V Ω pF Note 1: Based on IEC61000-4-5 8/20 µs pulse. Note 2: TLP parameter: Z0 = 50 Ω, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of dynamic resistance using a least-squares fit of TLP characteristics at IPP between 8 A to 16 A. Note 3: Guaranteed by design. 2022-09-07 Rev.2.0 ©2018-2022 Toshiba Electronic Devices & Storage Corporation |
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