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APTDF100H60G 数据表(PDF) 2 Page - Microsemi Corporation |
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APTDF100H60G 数据表(HTML) 2 Page - Microsemi Corporation |
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2 / 4 page ![]() APTDF100H60G www.microsemi.com 2 - 4 All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic Test Conditions Min Typ Max Unit IF = 100A 1.6 2.0 IF = 200A 2.0 VF Diode Forward Voltage IF = 100A Tj = 125°C 1.3 V Tj = 25°C 250 IRM Maximum Reverse Leakage Current VR = 600V Tj = 125°C 500 µA CT Junction Capacitance VR = 600V 190 pF Dynamic Characteristics Symbol Characteristic Test Conditions Min Typ Max Unit trr Reverse Recovery Time IF=1A,VR=30V di/dt = 100A/µs Tj = 25°C 34 ns Tj = 25°C 160 trr Reverse Recovery Time Tj = 125°C 220 ns Tj = 25°C 290 Qrr Reverse Recovery Charge Tj = 125°C 1530 nC Tj = 25°C 5 IRRM Reverse Recovery Current IF = 100A VR = 400V di/dt = 200A/µs Tj = 125°C 13 A trr Reverse Recovery Time 100 ns Qrr Reverse Recovery Charge 2890 nC IRRM Reverse Recovery Current IF = 100A VR = 400V di/dt=1000A/µs Tj = 125°C 44 A Thermal and package characteristics Symbol Characteristic Min Typ Max Unit RthJC Junction to Case Thermal Resistance 0.55 °C/W VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V TJ Operating junction temperature range -40 175 TSTG Storage Temperature Range -40 125 TC Operating Case Temperature -40 100 °C Torque Mounting torque To Heatsink M5 2.5 4.7 N.m Wt Package Weight 160 g |
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