Soldering Profile

13

PDS-001540 Rev 17

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SBT-90-R/W Product Datasheet

Note 1: Product complies to Moisture Sensitivity Level 1 (MSL 1).

Note 2: The numbers in the table are specific to SAC305. Luminus recommends using an SAC305 solder paste with a no-clean flux for RoHS compliant

products.

Note 3: During the pick and place process, axial forces on the dome (or window) should not exceed 0.5 Newtons (N).

Note 4: Use of a multi-zone IR reflow oven with a nitrogen blanket is recommended.

Note 5: Time-temperature profile of the reflow process showing the four functional profile zones are defined in IPC-7801. Temperature is referenced

to the center of the PCB.

Note 6: Luminus recommends to use the solder paste data sheet information as a starting point in time-temperature process development.

Note 7: Vapor phase soldering is not recommended as the package is not hermetic.

Note 8: These are general guidelines. Consult the solder paste manufacturer’s datasheet for guidelines specific to the alloy and flux combination used

in your application. For more information, please refer to:

https://luminusdevices.zendesk.com/hc/en-us/articles/360060306692-How-do-I-Reflow-Solder-Luminus-SMD-Components-

Note 9: For any technical questions about soldering process, please contact Luminus at techsupport@luminus.com.

SMT Rework Guideline

Manual Hotplate Reflow

Hot Air Gun Reflow

Heating Time

< 60 sec

Hotplate Temperature

< 245°C

< 150°C

Time

Preheat

RT to 150°C

1 - 2.5°C/sec

Soak

150°C to 180°C

0.4 - 1°C/sec

Reflow

180 to TL + 20°C

3 - 6°C/sec

Cool down

Peak to below 150°C

3 - 7°C/sec

Liquidus Temperature, TL (SAC305 = 220°C)

Peak Temperature (235 - 245°C)

Time Above Liquidus

(45 - 90 sec)

65 -> 200°C, 120 - 250 sec max