177

MAXIMUM RATINGS

Operating Temperature: -65°C to +175°C

Storage Temperature: -65°C to +175°C

REVERSE LEAKAGE CURRENT

ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise specified.

-55° TO +100°

CDI

ZENER

ZENER

MAXIMUM

VOLTAGE

EFFECTIVE

TYPE

VOLTAGE

TEST

ZENER

TEMPERATURE TEMPERATURE

NUMBER

CURRENT

IMPEDANCE

STABILITY

COEFFICIENT

V

ZT

@ I

ZT

I

ZT

Z

ZT

³V

ZT

(Note 1)

(Note 2)

VOLTS

mA

OHMS

mV

% / °C

CD821

5.9 - 6.5

7.5

15

96

0.01

CD821A

5.9 - 6.5

7.5

10

96

0.01

CD823

5.9 - 6.5

7.5

15

48

0.005

CD823A

5.9 - 6.5

7.5

10

48

0.005

CD825

5.9 - 6.5

7.5

15

19

0.002

CD825A

5.9 - 6.5

7.5

10

19

0.002

CD826

5.9 - 6.5

7.5

15

20

0.002

CD827

5.9 - 6.5

7.5

15

9

0.001

CD827A

5.9 - 6.5

7.5

10

9

0.001

CD828

6.2 - 6.9

7.5

15

10

0.001

CD829

5.9 - 6.5

7.5

15

5

0.0005

CD829A

5.9 - 6.5

7.5

10

5

0.0005

NOTE 1

Zener impedance is derived by superimposing on l

ZT

A 60Hz rms a.c.

current equal to 10% of l

ZT.

NOTE 2

The maximum allowable change observed over the entire temperature

range i.e.,the diode voltage will not exceed the specified mV at any

discrete temperature between the established limits, per JEDEC

standard No.5.

Backside is not cathode

and must be electrically isolated

T = Metallization Test Pad

DESIGN DATA

METALLIZATION:

Top: C (Cathode) ..................Al

A (Anode) ..................... Al

Back: .......................................Au

AL THICKNESS.........25,000

GOLD THICKNESS......4,000

CHIP THICKNESS. ..............10 Mils

CIRCUIT LAYOUT DATA:

Backside must be electrically

isolated.

Backside is not cathode.

For Zener operation cathode must

be operated positive with respect

to anode.

TOLERANCES: ALL

Dimensions + 2 mils

• 1N821 THRU 1N829 AVAILABLE IN

JANHC AND JANKC

PER MIL-PRF-19500/159

• MONOLITHIC TEMPERATURE COMPENSATED ZENER REFERENCE CHIPS

• ALL JUNCTIONS COMPLETELY PROTECTED WITH SILICON DIOXIDE

• ELECTRICALLY EQUIVALENT TO 1N821 THRU 1N829

• COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES,

WITH THE EXCEPTION OF SOLDER REFLOW

CD821

thru

CD829A

6

LAKE

STREET,

LAWRENCE,

MASSACHUSETTS 01841

PHONE (978) 620-2600

FAX (978) 689-0803

WEBSITE: http://www.microsemi.com