7-14

Model 170

Substrate

Alumina, beryllia, aluminum nitride, aluminum, copper

Interconnect Layers

1 (crossover layers possible)

Interconnect Material

Copper

Die Attach

Solder attached, aluminum & gold wire bonding

Package Construction

Substrate base with plastic frame

ELECTRICAL

Semiconductor Components

BJTs, FETs, Diodes, SCRs, IGBTs

Capacitors

Ceramic and tantalum

Other Components

Resistors, thermisters and various surface mount/solder mount components

MECHANICAL

ENVIRONMENTAL

Custom power modules are typically designed to operate over a temperature range of -40°C to +125°C.