MP6604C

– 4.5V TO 45V, 2.5A, SIMPLE DUAL H-BRIDGE DRIVER (HS/LS)

MP6604C Rev. 1.1

MonolithicPower.com

14

5/12/2023

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APPLICATION INFORMATION

Selecting the External Components

Bypass the two VIN pins to GND using a

minimum 100nF ceramic capacitor with X7R

dielectrics, placed as close to the IC as

possible. Place an additional 1µF to 10µF

ceramic capacitor close to the 100nF capacitor.

Depending on the supply impedance and

distance

to

other

large

capacitors,

an

electrolytic bulk capacitor may also be required

to stabilize VIN.

Connect a 100nF ceramic capacitor rated for

VIN between the CPA and CPB pins. Connect a

1µF, 16V ceramic capacitor between the VIN

and VCP pins.

Connect a 1µF, 16V ceramic capacitor with

X7R dielectrics from the VREG pin to GND.

PCB Layout Guidelines

Efficient

PCB

layout

is

critical

for

stable

operation. For the best results, refer to Figure 3

and Figure 4, and follow the guidelines below:

1. Place the supply bypass and charge pump

capacitors as close to the IC as possible

ideally adjacent to the pins on the same

PCB layer.

2. Each VIN pin requires a bypass capacitor.

3. Place as much copper on the long pads as

possible.

4. Place large copper areas on the pads and

the

device’s outer copper layer.

5. The thermal pad should be soldered directly

to the copper on the PCB.

6. Add thermal vias to transfer heat to the

other PCB layers.

Figure 3: Recommended PCB Layout

(MP6604CGF)

Figure 4: Recommended PCB Layout

(MP6604CGV)