SS12FP − S115FP

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2

THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1)

Symbol

Parameter

Value

Unit

YJL

Thermal Characteristics, Junction−to−Lead (Note 2)

10

°C/W

RqJA

Thermal Resistance, Junction−to−Ambient

140

°C/W

1. Per JESD51−3 recommended thermal test board. Device mounted on FR−4 PCB, board size = 76.2 mm x 114.3 mm.

2. Thermocouple soldered at cathode lead.

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Value

Unit

SS12

FP

SS13

FP

SS14

FP

SS16

FP

S110

FP

S115

FP

VF

Maximum Instantaneous

Forward Voltage (Note 3)

IF = 0.5 A

0.51

0.58

0.70

0.75

V

IF = 1.0 A

0.45

0.50

0.55

0.70

0.80

0.90

IR

Maximum Reverse Current

at Rated VR

TJ = 25°C

0.40

0.05

mA

TJ = 125°C

0.50

CJ

Typical Junction Capacitance

VR = 4 V,

f = 1 MHz

54

28

pF

Trr

Typical Reverse Recovery Time IF = 0.5 A,

IR = 1 A,

IRR = 0.25 A

6

14

ns

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

3. Pulse test with PW = 300 ms, 1% duty cycle.

ORDERING INFORMATION

Part Number

Device Code Marking

Package

Packing Method†

SS12FP

2FP

SOD−123EP

Tape and Reel

SS13FP

3FP

SOD−123EP

Tape and Reel

SS14FP

4FP

SOD−123EP

Tape and Reel

SS16FP

6FP

SOD−123EP

Tape and Reel

S110FP

0FP

SOD−123EP

Tape and Reel

S115FP

AFP

SOD−123EP

Tape and Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.