MCP606/7/8/9

DS11177D-page 16

© 2005 Microchip Technology Inc.

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

XXXXXXXX

XXXXXNNN

YYWW

8-Lead PDIP (300 mil)

Example:

8-Lead TSSOP

Example:

8-Lead SOIC (150 mil)

Example:

XXXXXXXX

XXXXYYWW

NNN

XXXX

YYWW

NNN

5-Lead SOT-23-5

Example:

XXNN

SB25

MCP606

I/P^^256

0545

MCP606

SN^^0545

256

606

I545

256

Legend: XX...X

Customer-specific information

Y

Year code (last digit of calendar year)

YY

Year code (last 2 digits of calendar year)

WW

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

3

e

3

e

3

e

3

e